JPH0170327U - - Google Patents
Info
- Publication number
- JPH0170327U JPH0170327U JP1987165467U JP16546787U JPH0170327U JP H0170327 U JPH0170327 U JP H0170327U JP 1987165467 U JP1987165467 U JP 1987165467U JP 16546787 U JP16546787 U JP 16546787U JP H0170327 U JPH0170327 U JP H0170327U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- etching
- vacuum chamber
- evacuated
- film thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Drying Of Semiconductors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165467U JPH0170327U (en]) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165467U JPH0170327U (en]) | 1987-10-29 | 1987-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0170327U true JPH0170327U (en]) | 1989-05-10 |
Family
ID=31451977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987165467U Pending JPH0170327U (en]) | 1987-10-29 | 1987-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0170327U (en]) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593925A (ja) * | 1982-06-29 | 1984-01-10 | Ulvac Corp | ドライエツチングの制御および終点検出方法 |
JPS5974636A (ja) * | 1982-10-22 | 1984-04-27 | Hitachi Ltd | 膜厚測定装置 |
JPS61124136A (ja) * | 1984-11-20 | 1986-06-11 | Nec Corp | 反応性イオンエツチング装置 |
JPS6248022A (ja) * | 1985-08-28 | 1987-03-02 | Nec Corp | 半導体基板エツチング装置 |
-
1987
- 1987-10-29 JP JP1987165467U patent/JPH0170327U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593925A (ja) * | 1982-06-29 | 1984-01-10 | Ulvac Corp | ドライエツチングの制御および終点検出方法 |
JPS5974636A (ja) * | 1982-10-22 | 1984-04-27 | Hitachi Ltd | 膜厚測定装置 |
JPS61124136A (ja) * | 1984-11-20 | 1986-06-11 | Nec Corp | 反応性イオンエツチング装置 |
JPS6248022A (ja) * | 1985-08-28 | 1987-03-02 | Nec Corp | 半導体基板エツチング装置 |